शब्दकोश · हार्डवेयर

Thermal Paste

Thermal paste is a thermally conductive compound applied between a chip and its cooler to fill microscopic gaps and improve heat transfer.

अपडेट: अक्टूबर 6, 2026

Thermal paste, also called thermal compound or thermal interface material, is a conductive gel applied between a processor and its cooler. It fills microscopic air gaps in the metal surfaces, because air is a poor heat conductor.

Why it matters

Even polished surfaces are rough at a tiny scale, so touching metal parts trap air. Paste replaces that air with a material that conducts heat much better, so the cooler can carry heat away efficiently. Too little paste leaves gaps, and too much can squeeze out and does not improve cooling. Paste is not a substitute for a good cooler; it is a thin layer that helps the metal parts make contact.

Types include ceramic and silicone-based pastes, which are non-conductive and safe for most users, and liquid metal, which conducts electricity and can damage aluminium, so it needs careful handling.

Example

For a typical desktop CPU, a pea-sized dot at the centre of the heat spreader is commonly used. Mounting the cooler spreads it into a thin layer. If temperatures at idle suddenly rise by 10 degrees or more years after building, dried paste may be a cause.

Common mistakes

  • Applying a thick layer.
  • Reusing the cooler without cleaning off old paste with isopropyl alcohol.
  • Using liquid metal on aluminium or near exposed components.
  • Forgetting that many coolers come with pre-applied paste.

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